A new network-on-chip (NoC) IP aims to dramatically accelerate chip development by introducing artificial intelligence (AI)-driven automation and reducing wire length to lower power use in ...
Harrisburg, Pa. — Tyco Electronics has beefed up its product offering for secondary power circuit applications with the introduction of its AMP Economy Power (EP) wire-to-board interconnect system.
Meeting UL outdoor use requirements for solar panel applications, the WVL series of weatherproof wire-to-wire connectors is designed to withstand extreme moisture and ultra-violet exposure. The ...
Omega’s XT insulated wire along with the XC braided insulation sleeving has provided electrical conductor solutions for SOFC fuel cell interconnect applications. May 13, 2011 This series of electrical ...
The Mizu-P25 2.5-mm pitch connector is supposedly the first and only sealed wire-to-wire system of its size in the market certified to the IP67 standard. The Mizu-P25 2.5-mm pitch connector is ...
3D Interconnect Designer simplifies high-speed 3D interconnect design for silicon bridges and interposers. As chiplet architectures are increasingly adopted, engineers face complex 3D interconnect ...
Avicena, the pioneer in microLED-based optical interconnects, today announced the LightBundle™ eKit, the industry’s first evaluation platform for microLED optical connectivity using ASIC-based ...